"We've moved beyond the era of two dimensional chips.  The costs in terms of power consumption, performance, functionality and die size are simply to great to continue development on that path.  The next wave of chip innovation will center around 3D die stacking, with through silicon vias and very fine grained alignment.  This is absolutely nothing short of a revolution in semiconductor development.

Chips will never be the same!"

"We have reached the perilous edge of die area expansion.  Since we can't keep pushing out, we have to move up.  The Z dimension allows us to increase performance and functionality, while keeping power, costs and package size low.  4D Chips has assembled an ecosystem of expert partners, backed by patented manufacturing innovation, that will enable virtually unlimited vertical integration.

The next wave is UP!"