Reduce Power Consumption!
Improve Performance!
Maximize Interchip Bandwdidth!
Maximum Functionality!
Minimize Package Footprint!
Lower System Cost!
Manage System Complexity!
Higher Levels of Integration!
Reduce Power Consumption!
Improve Performance!
Maximize Interchip Bandwdidth!
Maximum Functionality!
Minimize Package Footprint!
Lower System Cost!
Manage System Complexity!
Higher Levels of Integration!
"We've moved beyond the era of two dimensional chips. The costs in terms of power consumption, performance, functionality and die size are simply to great to continue development on that path. The next wave of chip innovation will center around 3D die stacking, with through silicon vias and very fine grained alignment. This is absolutely nothing short of a revolution in semiconductor development.
Chips will never be the same!"
"We have reached the perilous edge of die area expansion. There's simply no where else to go. Since we can't keep pushing out, we have to move up. Much like boundary constrained urban areas, the inevitable pressure to grow forces the development of sky scrapers. For semiconductors, the Z dimension allows us to increase performance and functionality, while keeping power consumption, costs and package size low.
The new frontier is UP!"
The era of increasing functionality by expanding die area is over. Much like boundary constrained urban areas, the only option is to go vertical.
4D Chips has assembled an ecosystem of expert partners, backed by proprietary manufacturing innovation, that supports virtually unlimited vertical integration. We provide a turnkey solution that allows system designers to effectively meet end-user requirements for performance, power consumption, functionality, form factor and cost. Our technology and services offer system vendors the most efficient path to realize world-class products through vertical integration.
Madhu's extensive history with the semiconductor industry includes R&D work at both IBM and Fairchild. His particular research interests include silicon devices, circuit optimization and system development. A prolific innovator and inventor, Madhu has a number of patents issues and several more pending. He has also been a successful entrepreneur. LinkedIn
Dean's career spans nearly thirty years of engineering, marketing and general management. He has extensive experience developing, selling and delivering, world-class semiconductor, software and service products. As a member of the founding team at 4DChips, Dean is thrilled to be part of the effort to take product innovation to the next level.
Dean graduated from the University of Idaho so long ago that his first real job was writing FORTRAN code for a CDC mainframe. Subsequent to that experience, he developed EDA software, designed chips, managed software & IC design efforts, developed mobile applications and founded five companies. He is a long time member of IEEE, and is now learning Objective-C 2.0. Twitter LinkedIn